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MLF2012DR56KT000 - TDK

Description: SMD / SMT Inductors (Coils), L=0.56?H, L x W x T :

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MLF2012DR56KT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - mlf2012
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MLF2012DR56KT000 - TDK  - 3D model - Inductors Chip - mlf2012
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MLF2012DR56KT000 Details

  • Manufacturer Part Number:

    MLF2012DR56KT000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.55 Ω

  • Inductance-Nom (L):

    0.56 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    25

  • Rated Current-Max:

    0.15 A

  • Self Resonance Frequency:

    150 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN NICKEL COPPER

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    10%

MLF2012DR56KT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR56KT000 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure that the component is placed on a thermal land with a size of at least 2mm x 2mm, and use a thermal via to connect to a solid copper plane on the PCB.
  • The maximum operating temperature for MLF2012DR56KT000 is 125°C, with a derating of 1.25% per °C above 85°C.
  • To ensure reliability in high-vibration environments, use a secure mounting method such as underfill or a mechanical clamp, and ensure that the PCB is designed to minimize flexure and vibration.
  • The recommended reflow profile for MLF2012DR56KT000 is a peak temperature of 260°C, with a dwell time above 220°C of 20-40 seconds, and a ramp-up rate of 3°C/second.

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MLF2012DR56KT000 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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