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MLF2012DR56KTD25 - TDK

Description: Fixed Inductors 560nH 550mohms 150mA +/-10% Fer AEC-Q200

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PCB Footprints
MLF2012DR56KTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(0.85T)
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3D Models
MLF2012DR56KTD25 - TDK  - 3D model - Inductors Chip - MLF2012(0.85T)
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MLF2012DR56KTD25 Details

  • Manufacturer Part Number:

    MLF2012DR56KTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.55 Ω

  • Inductance-Nom (L):

    0.56 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    25

  • Rated Current-Max:

    0.15 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    150 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    10%

MLF2012DR56KTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR56KTD25 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 1.2mm x 0.8mm and a solder mask clearance of 0.1mm.
  • The thermal derating of MLF2012DR56KTD25 can be handled by following the guidelines provided in the datasheet. Typically, the component's power rating decreases as the ambient temperature increases. For example, the power rating may be reduced by 50% when the ambient temperature exceeds 70°C.
  • The moisture sensitivity level of MLF2012DR56KTD25 is typically Level 3, which means it can withstand a maximum of 168 hours of exposure to 30°C/60%RH before soldering. It's essential to follow the recommended storage and handling procedures to prevent moisture absorption.
  • Yes, MLF2012DR56KTD25 is designed to withstand vibrations up to 10G. However, it's essential to ensure that the component is properly mounted and secured to the PCB to prevent mechanical stress and damage.
  • The ESR of MLF2012DR56KTD25 can be determined by measuring the impedance of the component at high frequencies (e.g., 100 kHz) using an impedance analyzer or a network analyzer. The ESR is typically specified in the datasheet, but it may vary depending on the frequency and operating conditions.

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MLF2012DR56KTD25 Overview

Use the download button to access the MLF2012DR56KTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLF2012DR56KT000 TDK Corporation

General Purpose Inductor, 0.56uH, 10%, 1 Element, Ferrite-Core, SMD, 0805