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MLF2012DR82MTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=0.82?H, L x W x T :

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Symbol
MLF2012DR82MTD25 - TDK - PCB symbol
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PCB Footprints
MLF2012DR82MTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(1.25T)
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3D Models
MLF2012DR82MTD25 - TDK - 3D model - Inductors Chip - MLF2012(1.25T)
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MLF2012DR82MTD25 Details

  • Manufacturer Part Number:

    MLF2012DR82MTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.65 Ω

  • Inductance-Nom (L):

    0.82 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    25

  • Rated Current-Max:

    0.15 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    130 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    20%

MLF2012DR82MTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR82MTD25 is available in the TDK Corporation's application note or can be obtained by contacting their technical support. The land pattern should be designed to ensure good solderability and thermal dissipation.
  • Handle the MLF2012DR82MTD25 by the edges to prevent damage to the terminations. Avoid touching the component's body or leads to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat if necessary.
  • The maximum reflow temperature for MLF2012DR82MTD25 is 260°C, as specified in the datasheet. Exceeding this temperature may cause damage to the component.
  • Yes, MLF2012DR82MTD25 is designed to withstand vibrations. However, it's essential to ensure that the component is properly mounted and secured to the PCB to prevent mechanical stress and damage.
  • The ESR of MLF2012DR82MTD25 can be determined by measuring the impedance of the component using an impedance analyzer or a network analyzer. The ESR is typically specified in the datasheet, but it may vary depending on the frequency and operating conditions.

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MLF2012DR82MTD25 Overview

Use the download button to access the MLF2012DR82MTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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