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MLF2012K390KTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=39?H, L x W x T :

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MLF2012K390KTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - mlf2012
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MLF2012K390KTD25 - TDK  - 3D model - Inductors Chip - mlf2012
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MLF2012K390KTD25 Details

  • Manufacturer Part Number:

    MLF2012K390KTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.8

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    2.4 Ω

  • Inductance-Nom (L):

    39 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    35

  • Rated Current-Max:

    0.004 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    13 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    10%

MLF2012K390KTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012K390KTD25 is available in the TDK Corporation's recommended footprint document, which can be found on their website. The document provides detailed information on the recommended pad layout, solder mask, and solder fillet dimensions.
  • To prevent damage, it is recommended to handle the MLF2012K390KTD25 by the edges, avoiding touching the component's terminals or body. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Additionally, follow the recommended soldering temperature and time profiles to prevent thermal damage.
  • The MLF2012K390KTD25 is designed to withstand moderate vibration levels. However, for high-vibration environments, it is recommended to consult with TDK Corporation's application engineers to determine the suitability of the component. They can provide guidance on the component's vibration tolerance and suggest alternative components if necessary.
  • The ESR of the MLF2012K390KTD25 is not explicitly stated in the datasheet. However, it can be calculated using the component's impedance vs. frequency characteristics, which are typically provided in the component's impedance profile graph. Alternatively, you can contact TDK Corporation's technical support for assistance in determining the ESR value.
  • Yes, the MLF2012K390KTD25 is compatible with lead-free soldering processes. TDK Corporation's MLF series components are designed to meet the requirements of lead-free soldering, and the component's terminations are made of a lead-free material.

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MLF2012K390KTD25 Overview

Use the download button to access the MLF2012K390KTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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