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MLF2012K390MT000 - TDK

Description: SMD / SMT Inductors (Coils), L=39?H, L x W x T :

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PCB Footprints
MLF2012K390MT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(1.25T)
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3D Models
MLF2012K390MT000 - TDK  - 3D model - Inductors Chip - MLF2012(1.25T)
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MLF2012K390MT000 Details

  • Manufacturer Part Number:

    MLF2012K390MT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.8

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    2.4 Ω

  • Inductance-Nom (L):

    39 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    35

  • Rated Current-Max:

    0.004 A

  • Self Resonance Frequency:

    13 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    20%

MLF2012K390MT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012K390MT000 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for MLF2012K390MT000, ensure that the component is placed on a thermal pad or a copper pour on the PCB to dissipate heat efficiently. The thermal pad should be connected to a ground plane or a heat sink to further improve heat dissipation.
  • The maximum reflow temperature for MLF2012K390MT000 is 260°C, with a peak temperature of 240°C for a maximum of 20 seconds. It's essential to follow the recommended reflow profile to prevent damage to the component.
  • While MLF2012K390MT000 is a robust component, it's not designed for high-vibration environments. If your application requires high vibration resistance, consider using a component with a more robust mechanical design, such as a ceramic or metal-cased inductor.
  • To ensure the reliability of MLF2012K390MT000 in a humid environment, apply a conformal coating to the PCB to prevent moisture ingress. Additionally, consider using a component with a higher moisture sensitivity level (MSL) rating, such as MSL 3 or higher.

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MLF2012K390MT000 Overview

Use the download button to access the MLF2012K390MT000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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