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MLG0603P10NJTD25 - TDK

Description: Multilayer Ceramic Inductors for High Frequency Circuits

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PCB Footprints
MLG0603P10NJTD25 - TDK PCB footprint - Other - Other - MLG0603
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MLG0603P10NJTD25 - TDK  - 3D model - Other - MLG0603
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MLG0603P10NJTD25 Details

  • Manufacturer Part Number:

    MLG0603P10NJTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    8

  • Case/Size Code:

    0201

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.95 Ω

  • Inductance-Nom (L):

    0.01 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    0.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    14

  • Rated Current-Max:

    0.25 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    4000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    500 MHz

  • Tolerance:

    5%

MLG0603P10NJTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG0603P10NJTD25 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to ensure good solderability and to prevent solder bridging.
  • The MLG0603P10NJTD25 is a sensitive component and requires careful handling during the soldering process. It is recommended to use a soldering temperature of 260°C or lower, and to avoid exposing the component to temperatures above 280°C for more than 30 seconds. Additionally, a nitrogen atmosphere can be used to reduce oxidation and improve solderability.
  • The maximum current rating for the MLG0603P10NJTD25 is 1.5A, based on a temperature rise of 40°C. However, the actual current rating may vary depending on the operating frequency, temperature, and other factors. It is recommended to derate the current rating based on the specific application requirements.
  • The inductance value of the MLG0603P10NJTD25 decreases with increasing frequency. According to the datasheet, the inductance value is 10nH at 100MHz, but it may decrease to around 7-8nH at higher frequencies (e.g. 500MHz). It is recommended to consult the datasheet or contact TDK Corporation for more information on the frequency characteristics of the component.
  • Yes, the MLG0603P10NJTD25 is compatible with lead-free soldering. TDK Corporation has qualified the component for use with lead-free soldering processes, and it meets the requirements of the RoHS directive. However, it is recommended to follow the recommended soldering profile and temperature guidelines to ensure reliable assembly.

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MLG0603P10NJTD25 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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