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MLG0603PR10HTD25 - TDK

Description: Multilayer Ceramic Inductors for High Frequency Circuits

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MLG0603PR10HTD25 - TDK - PCB symbol
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PCB Footprints
MLG0603PR10HTD25 - TDK PCB footprint - Other - Other - MLG0603
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3D Models
MLG0603PR10HTD25 - TDK - 3D model - Other - MLG0603
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MLG0603PR10HTD25 Details

  • Manufacturer Part Number:

    MLG0603PR10HTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.8

  • Case/Size Code:

    0201

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    4.5 Ω

  • Inductance-Nom (L):

    0.1 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    0.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    9

  • Rated Current-Max:

    0.08 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    900 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    300 MHz

  • Tolerance:

    3%

MLG0603PR10HTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG0603PR10HTD25 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • The MLG0603PR10HTD25 is a reflow-solderable component. It is recommended to use a peak reflow temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. The component should be placed on the PCB with the terminal facing downwards to prevent solder bridging.
  • Yes, the MLG0603PR10HTD25 is compatible with lead-free soldering. TDK Corporation uses a lead-free soldering process that meets the requirements of the RoHS directive.
  • The maximum operating temperature range for the MLG0603PR10HTD25 is -40°C to +125°C. However, the component's inductance and Q factor may vary depending on the operating temperature.
  • The MLG0603PR10HTD25 should be stored in a dry, cool place away from direct sunlight. It is recommended to store the components in their original packaging or in a sealed bag to prevent moisture absorption. When handling the components, it is recommended to use anti-static wrist straps or mats to prevent electrostatic discharge (ESD) damage.

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MLG0603PR10HTD25 Overview

Use the download button to access the MLG0603PR10HTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG06, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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