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MLG0603PR12JTD25 - TDK

Description: Multilayer Ceramic Inductors for High Frequency Circuits

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Symbol
MLG0603PR12JTD25 - TDK - PCB symbol
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PCB Footprints
MLG0603PR12JTD25 - TDK PCB footprint - Other - Other - MLG0603
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3D Models
MLG0603PR12JTD25 - TDK - 3D model - Other - MLG0603
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MLG0603PR12JTD25 Details

  • Manufacturer Part Number:

    MLG0603PR12JTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.8

  • Case/Size Code:

    0201

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    5 Ω

  • Inductance-Nom (L):

    0.12 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    0.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    9

  • Rated Current-Max:

    0.08 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    800 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    300 MHz

  • Tolerance:

    5%

MLG0603PR12JTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG0603PR12JTD25 is a rectangular pad with a size of 0.65mm x 0.65mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to ensure good solderability and to prevent solder bridging.
  • The MLG0603PR12JTD25 is a reflow-solderable component. The recommended reflow profile is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. The component should be placed on a solder paste layer with a thickness of 0.1-0.2mm.
  • Yes, the MLG0603PR12JTD25 is compatible with lead-free soldering. TDK Corporation uses a lead-free soldering process for this component, and it meets the requirements of the RoHS directive.
  • The maximum operating temperature of the MLG0603PR12JTD25 is 125°C. However, the component can withstand a maximum storage temperature of 150°C.
  • To ensure the reliability of the MLG0603PR12JTD25 in high-vibration applications, it is recommended to use a secure mounting method, such as soldering or adhesive bonding, and to ensure that the component is properly secured to the PCB. Additionally, the PCB should be designed to minimize flexure and vibration.

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MLG0603PR12JTD25 Overview

Use the download button to access the MLG0603PR12JTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG06, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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