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MLG0603S22NHT000 - TDK

Description: SMD / SMT Inductors (Coils), L=22nH, L x W x T :

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MLG0603S22NHT000 - TDK PCB footprint - Other - Other - MLG0603S
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MLG0603S22NHT000 - TDK  - 3D model - Other - MLG0603S
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MLG0603S22NHT000 Details

  • Manufacturer Part Number:

    MLG0603S22NHT000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.6

  • Case/Size Code:

    0201

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    1.2 Ω

  • Inductance-Nom (L):

    0.022 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    0.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    6

  • Rated Current-Max:

    0.15 A

  • Self Resonance Frequency:

    2000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    3%

MLG0603S22NHT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG0603S22NHT000 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a clearance of at least 0.1mm from the component body.
  • The MLG0603S22NHT000 has a maximum operating temperature of 125°C. To ensure reliable operation, the inductor should be kept away from heat sources, and the PCB should be designed to dissipate heat efficiently. A thermal via or a heat sink can be used to improve heat dissipation if necessary.
  • The self-resonant frequency (SRF) of the MLG0603S22NHT000 is not explicitly stated in the datasheet, but it can be estimated to be around 1.5-2 times the maximum operating frequency. For this inductor, the SRF is likely to be in the range of 300-400 MHz.
  • The MLG0603S22NHT000 is a surface-mount device (SMD) and is designed to withstand normal vibration and shock. However, if the application involves extreme vibration or shock, additional mechanical support or potting may be necessary to ensure the inductor's reliability.
  • The MLG0603S22NHT000 is a molded inductor with a moisture sensitivity level (MSL) of 1, which means it can withstand normal humidity levels. However, in extremely humid environments, additional precautions such as conformal coating or hermetic sealing may be necessary to ensure the inductor's reliability.

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MLG0603S22NHT000 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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For a full list of alternate parts for MLG0603S22NHT000, check out Findchips.com