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MLG1005S1N2CTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005S1N2CTD25 - TDK PCB footprint - Other - Other - MLG1005
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MLG1005S1N2CTD25 - TDK  - 3D model - Other - MLG1005
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MLG1005S1N2CTD25 Details

  • Manufacturer Part Number:

    MLG1005S1N2CTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.75

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.1 Ω

  • Inductance-Nom (L):

    0.0012 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    7

  • Rated Current-Max:

    1 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    10000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    0.2NH IS THE TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    0.17%

MLG1005S1N2CTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S1N2CTD25 can be found in the TDK Corporation's recommended footprint document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad layout, size, and spacing for optimal performance and reliability.
  • The MLG1005S1N2CTD25 is a sensitive component and requires proper handling and storage to prevent moisture and humidity damage. It is recommended to store the components in a dry, cool place, and to follow the recommended baking and drying procedures before soldering. Additionally, the use of a nitrogen-filled packaging or a desiccant can help to minimize the risk of moisture damage.
  • The maximum reflow temperature for the MLG1005S1N2CTD25 is typically around 260°C, but it's recommended to follow the recommended reflow profile provided by TDK Corporation or to consult with their application engineers for specific guidance. Exceeding the maximum reflow temperature can cause damage to the component or affect its performance.
  • The MLG1005S1N2CTD25 is designed to meet the requirements of various industries, including automotive and industrial, which often involve high-vibration or high-shock environments. However, it's recommended to consult with TDK Corporation's application engineers to ensure that the component meets the specific requirements of your application and to discuss any necessary precautions or design considerations.
  • To troubleshoot issues with the MLG1005S1N2CTD25, it's recommended to follow a systematic approach, including checking the component's datasheet, application notes, and any relevant documentation. Additionally, consulting with TDK Corporation's application engineers or technical support team can provide valuable guidance and expertise. They can help identify the root cause of the issue and provide recommendations for resolving the problem.

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MLG1005S1N2CTD25 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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