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MLG1005S2N4STD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005S2N4STD25 - TDK PCB footprint - Other - Other - MLG1005
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MLG1005S2N4STD25 - TDK  - 3D model - Other - MLG1005
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MLG1005S2N4STD25 Details

  • Manufacturer Part Number:

    MLG1005S2N4STD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    8

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.15 Ω

  • Inductance-Nom (L):

    0.0024 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    7

  • Rated Current-Max:

    0.8 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    7000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    0.3NH IS THE TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    0.13%

MLG1005S2N4STD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S2N4STD25 can be found in the TDK Corporation's application note or footprint library. It typically includes a rectangular pad with a size of around 1.2mm x 0.8mm, with a 0.3mm hole in the center for the component's terminal.
  • The MLG1005S2N4STD25 is a moisture-sensitive device. To handle it, follow the standard moisture-sensitive device handling procedures, such as storing it in a dry environment, using a dry pack or nitrogen-filled packaging, and baking the component before reflow soldering if it has been exposed to moisture.
  • The maximum reflow temperature for the MLG1005S2N4STD25 is typically around 260°C, with a peak temperature not exceeding 240°C. However, it's recommended to follow the specific reflow profile recommended by TDK Corporation or the PCB manufacturer to ensure reliable soldering.
  • The MLG1005S2N4STD25 is designed to withstand moderate vibration levels. However, if the application involves high vibration, it's recommended to perform additional testing and analysis to ensure the component's reliability and performance. TDK Corporation may also provide additional guidance or recommendations for high-vibration applications.
  • To troubleshoot issues with the MLG1005S2N4STD25, follow a systematic approach, checking for proper component orientation, soldering, and PCB design. Use tools like oscilloscopes, signal generators, and impedance analyzers to debug the circuit. Consult TDK Corporation's application notes, datasheets, and technical support resources for guidance.

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MLG1005S2N4STD25 Overview

Use the download button to access the MLG1005S2N4STD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLG1005S2N4CTD25 TDK Corporation

General Purpose Inductor, 0.0024uH, 0.08%, 1 Element, Ceramic-Core, SMD, 0402