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MLG1005S33NHTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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MLG1005S33NHTD25 - TDK - PCB symbol
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PCB Footprints
MLG1005S33NHTD25 - TDK PCB footprint - Other - Other - MLG1005
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3D Models
MLG1005S33NHTD25 - TDK - 3D model - Other - MLG1005
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MLG1005S33NHTD25 Details

  • Manufacturer Part Number:

    MLG1005S33NHTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.6

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.9 Ω

  • Inductance-Nom (L):

    0.033 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.3 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    1400 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    3%

MLG1005S33NHTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S33NHTD25 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 1.2mm x 0.8mm and a thermal via to ensure good thermal dissipation.
  • The MLG1005S33NHTD25 is a moisture-sensitive device. To handle it, follow the standard moisture-sensitive device handling procedures, such as storing it in a dry environment, using a dry pack or nitrogen-filled packaging, and baking it before reflow soldering if it has been exposed to moisture.
  • The maximum reflow temperature for the MLG1005S33NHTD25 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component.
  • Yes, the MLG1005S33NHTD25 is designed for high-frequency applications up to 1 GHz. However, it's essential to consider the component's self-resonant frequency, which is around 1.2 GHz, and ensure that it does not resonate at the operating frequency.
  • To ensure magnetic shielding in a densely populated PCB, keep the MLG1005S33NHTD25 away from other magnetic components, use a ground plane or shield layer, and consider using a magnetic shield can or potting the component.

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MLG1005S33NHTD25 Overview

Use the download button to access the MLG1005S33NHTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG10, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLG1005S33NHT000 TDK Corporation

General Purpose Inductor, 0.033uH, 3%, 1 Element, Ceramic-Core, SMD, 0402