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MLG1005S39NHTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005S39NHTD25 - TDK PCB footprint - Other - Other - MLG1005
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MLG1005S39NHTD25 - TDK  - 3D model - Other - MLG1005
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MLG1005S39NHTD25 Details

  • Manufacturer Part Number:

    MLG1005S39NHTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.6

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    1 Ω

  • Inductance-Nom (L):

    0.039 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.25 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    1200 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    3%

MLG1005S39NHTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S39NHTD25 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 1.2mm x 0.8mm and a thermal via to ensure good thermal dissipation.
  • To handle the MLG1005S39NHTD25's sensitivity to moisture, it is recommended to follow the MSL (Moisture Sensitivity Level) guidelines provided by TDK Corporation. This includes storing the components in a dry environment, using a dry pack or a nitrogen-filled package, and following the recommended baking procedure before reflow soldering.
  • The maximum current rating for the MLG1005S39NHTD25 is not explicitly stated in the datasheet, but it can be calculated based on the inductor's impedance and the application's requirements. A general rule of thumb is to derate the current rating by 20-30% to ensure reliable operation.
  • The MLG1005S39NHTD25 is rated for operation up to 125°C, but its performance may degrade at higher temperatures. It is recommended to derate the component's specifications and consult with TDK Corporation's application engineers for specific guidance on high-temperature applications.
  • To ensure the MLG1005S39NHTD25's magnetic shielding, it is recommended to follow good PCB design practices, such as keeping the inductor away from other components, using a solid ground plane, and minimizing the loop area of the circuit. Additionally, using a shielded inductor or a mu-metal shield can help reduce electromagnetic interference (EMI).

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MLG1005S39NHTD25 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLG1005S39NHT000 TDK Corporation

General Purpose Inductor, 0.039uH, 3%, 1 Element, Ceramic-Core, SMD, 0402