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MLG1005S8N2HTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005S8N2HTD25 - TDK PCB footprint - Other - Other - MLG1005
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MLG1005S8N2HTD25 - TDK  - 3D model - Other - MLG1005
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MLG1005S8N2HTD25 Details

  • Manufacturer Part Number:

    MLG1005S8N2HTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.6

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.3 Ω

  • Inductance-Nom (L):

    0.0082 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.5 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    3000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    3%

MLG1005S8N2HTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005S8N2HTD25 is a rectangular pad with a size of 1.2mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a clearance of at least 0.2mm from the component body.
  • The MLG1005S8N2HTD25 has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate thermal relief by using thermal vias, thermal pads, or heat sinks. The component should be placed on a thermally conductive layer, and the PCB should be designed to dissipate heat efficiently.
  • The maximum current rating for the MLG1005S8N2HTD25 is 2.5A. However, the actual current handling capability may vary depending on the operating frequency, temperature, and other environmental factors. It's essential to derate the current according to the application requirements and ensure that the component is operated within its specified limits.
  • To ensure the MLG1005S8N2HTD25 meets the required impedance specifications, it's essential to consider the component's impedance characteristics, including the inductance, resistance, and Q-factor. The component should be selected based on the specific application requirements, and the PCB layout should be optimized to minimize parasitic inductance and capacitance.
  • The MLG1005S8N2HTD25 should be stored in a dry, clean environment, away from direct sunlight and moisture. The component should be handled with care to avoid mechanical stress, and electrostatic discharge (ESD) precautions should be taken to prevent damage. The component should be stored in its original packaging or an equivalent ESD-protective package.

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MLG1005S8N2HTD25 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLG1005S8N2HT TDK Corporation

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