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MLG1005SR22JTD25 - TDK

Description: Unshielded Multilayer Inductor 1A x 0402 (1005 Metric)

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PCB Footprints
MLG1005SR22JTD25 - TDK PCB footprint - Other - Other - MLG1005
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MLG1005SR22JTD25 - TDK  - 3D model - Other - MLG1005
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MLG1005SR22JTD25 Details

  • Manufacturer Part Number:

    MLG1005SR22JTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6.4

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    4.2 Ω

  • Inductance-Nom (L):

    0.22 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    8

  • Rated Current-Max:

    0.1 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    450 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    5%

MLG1005SR22JTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1005SR22JTD25 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 1.2mm x 1.4mm and a thermal via to ensure good thermal dissipation.
  • The MLG1005SR22JTD25 has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate thermal dissipation through a heat sink or thermal vias on the PCB. Additionally, avoid exposing the inductor to high temperatures during soldering or rework.
  • The self-resonant frequency (SRF) of the MLG1005SR22JTD25 is not explicitly stated in the datasheet. However, it can be estimated using the inductor's inductance value and the parasitic capacitance. Typically, the SRF is around 100-200 MHz for this type of inductor.
  • The MLG1005SR22JTD25 is designed for general-purpose use and has a relatively low self-resonant frequency. While it can be used in high-frequency applications, its performance may degrade above 10 MHz. For high-frequency applications above 50 MHz, consider using a specialized high-frequency inductor from TDK Corporation or other manufacturers.
  • To ensure the reliability of the MLG1005SR22JTD25 in a high-reliability application, follow proper PCB design and layout guidelines, use a robust soldering process, and ensure adequate thermal management. Additionally, consider using a inductor with a higher reliability rating, such as the TDK Corporation's automotive-grade inductors.

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MLG1005SR22JTD25 Overview

Use the download button to access the MLG1005SR22JTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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