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MLG1608B2N2ST000 - TDK

Description: TDK 2.2 nH ±0.3nH Multilayer SMD Inductor, 0603 (1608M) Case, SRF: 10.8GHz Q: 10 600mA dc 100mΩ Rdc

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PCB Footprints
MLG1608B2N2ST000 - TDK PCB footprint - Other - Other - MLG1608
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3D Models
MLG1608B2N2ST000 - TDK  - 3D model - Other - MLG1608
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MLG1608B2N2ST000 Details

  • Manufacturer Part Number:

    MLG1608B2N2ST000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP, 1608, ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    1608

  • Construction:

    Multilayer Chip

  • Core Material:

    FERRITE

  • DC Resistance:

    0.1 Ω

  • Inductance-Nom (L):

    0.0022 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    10

  • Rated Current-Max:

    0.6 A

  • Self Resonance Frequency:

    8000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    INDUCTANCE TOLERANCE IS 0.3 NANO HENRY

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    13.637%

MLG1608B2N2ST000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLG1608B2N2ST000 can be found in the TDK Corporation's application note or footprint library. It is essential to follow the recommended land pattern to ensure proper mounting and to prevent soldering issues.
  • Handle the MLG1608B2N2ST000 by the edges or the body, avoiding touching the electrodes or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The maximum reflow temperature for MLG1608B2N2ST000 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component or affect its reliability.
  • The MLG1608B2N2ST000 is designed to withstand moderate vibration levels. However, it is essential to evaluate the component's performance in your specific application, considering factors like vibration frequency, amplitude, and duration. You may need to add additional mechanical support or consider a different component if the vibration levels are extreme.
  • Store the MLG1608B2N2ST000 in its original packaging, away from direct sunlight, moisture, and extreme temperatures. Keep the storage area clean and dry, and avoid stacking components on top of each other. Follow the storage conditions recommended by TDK Corporation to maintain the component's shelf life.

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MLG1608B2N2ST000 Overview

Use the download button to access the MLG1608B2N2ST000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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