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MLG1608B3N9ST000 - TDK

Description: Unshielded Multilayer Inductor 0603 (1608 Metric)

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Symbol
MLG1608B3N9ST000 - TDK - PCB symbol
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PCB Footprints
MLG1608B3N9ST000 - TDK PCB footprint - Other - Other - MLG1608
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3D Models
MLG1608B3N9ST000 - TDK - 3D model - Other - MLG1608
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MLG1608B3N9ST000 Details

  • Manufacturer Part Number:

    MLG1608B3N9ST000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP, 1608, ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    1608

  • Construction:

    Multilayer Chip

  • Core Material:

    FERRITE

  • DC Resistance:

    0.14 Ω

  • Inductance-Nom (L):

    0.0039 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    10

  • Rated Current-Max:

    0.6 A

  • Self Resonance Frequency:

    6000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    INDUCTANCE TOLERANCE IS 0.3 NANO HENRY

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    7.693%

MLG1608B3N9ST000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG1608B3N9ST000 can be found in the TDK Corporation's application note or in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent defects.
  • To prevent damage, it is recommended to handle the MLG1608B3N9ST000 by the edges, avoiding touching the component's terminals or the ceramic body. It is also essential to use an anti-static wrist strap or mat to prevent electrostatic discharge damage.
  • The maximum reflow temperature for the MLG1608B3N9ST000 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component.
  • The MLG1608B3N9ST000 is designed to withstand moderate vibration levels. However, it is essential to evaluate the component's performance in the specific vibration environment to ensure reliable operation. TDK Corporation provides vibration testing data upon request.
  • To maintain the reliability of the MLG1608B3N9ST000, it is recommended to store the components in their original packaging, away from direct sunlight, moisture, and extreme temperatures. The storage environment should be clean, dry, and free from contaminants.

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MLG1608B3N9ST000 Overview

Use the download button to access the MLG1608B3N9ST000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG16, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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