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MLG1608B8N2DT000 - TDK

Description: Unshielded Multilayer Inductor 0603 (1608 Metric)

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PCB Footprints
MLG1608B8N2DT000 - TDK PCB footprint - Other - Other - MLG1608
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3D Models
MLG1608B8N2DT000 - TDK  - 3D model - Other - MLG1608
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MLG1608B8N2DT000 Details

  • Manufacturer Part Number:

    MLG1608B8N2DT000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP, 1608, ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    1608

  • Construction:

    Multilayer Chip

  • Core Material:

    FERRITE

  • DC Resistance:

    0.2 Ω

  • Inductance-Nom (L):

    0.0082 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    10

  • Rated Current-Max:

    0.6 A

  • Self Resonance Frequency:

    4500 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    INDUCTANCE TOLERANCE IS 0.5 NANO HENRY

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    6.098%

MLG1608B8N2DT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLG1608B8N2DT000 can be found in the TDK Corporation's recommended footprint document or by contacting their technical support. The land pattern should be designed to ensure good solderability and to prevent solder bridging between pads.
  • Handle the MLG1608B8N2DT000 by the edges or the body, avoiding touching the pads or the component itself. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The maximum reflow temperature for MLG1608B8N2DT000 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component or affect its reliability.
  • The MLG1608B8N2DT000 is designed to withstand normal vibration levels, but it may not be suitable for high-vibration environments. Consult with TDK Corporation's technical support or perform additional testing to ensure the component's reliability in such environments.
  • Store the MLG1608B8N2DT000 in its original packaging or in a dry, cool place (less than 30°C and 60% RH) to maintain its shelf life. Avoid exposing the component to direct sunlight, moisture, or contaminants.

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MLG1608B8N2DT000 Overview

Use the download button to access the MLG1608B8N2DT000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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