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MLP1608V1R0DT0S1 - TDK

Description: SMD / SMT Inductors (Coils), L=1?H, L x W x T :

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PCB Footprints
MLP1608V1R0DT0S1 - TDK PCB footprint - Inductors Chip - Inductors Chip - 0603 (1608) T=0.6±0.15mm
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3D Models
MLP1608V1R0DT0S1 - TDK  - 3D model - Inductors Chip - 0603 (1608) T=0.6±0.15mm
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MLP1608V1R0DT0S1 Details

  • Manufacturer Part Number:

    MLP1608V1R0DT0S1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6.6

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.3 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.6 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Current-Max:

    0.7 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT :30%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    20%

MLP1608V1R0DT0S1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLP1608V1R0DT0S1 can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • While the MLP1608V1R0DT0S1 is rated for operation up to 125°C, it's essential to consider the derating curves and temperature coefficients provided in the datasheet. Additionally, it's recommended to consult with TDK Corporation's application engineers to ensure the component can meet the specific requirements of your high-temperature application.
  • To prevent damage during PCB assembly, it's recommended to follow standard handling and assembly procedures for chip inductors. This includes using anti-static wrist straps, handling the components by the edges, and avoiding excessive bending or flexing of the PCB. Additionally, ensure that the PCB is properly cleaned and dried before assembly to prevent moisture-related damage.
  • The ESR of the MLP1608V1R0DT0S1 is not explicitly stated in the datasheet. However, it can be estimated based on the component's impedance and Q factor. Alternatively, you can contact TDK Corporation's application engineers for more information on the ESR of this specific component.
  • The MLP1608V1R0DT0S1 is designed for high-frequency applications, but its performance at high frequencies depends on various factors, including the PCB layout, component placement, and operating conditions. It's recommended to consult with TDK Corporation's application engineers to ensure the component can meet the specific requirements of your high-frequency application.

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MLP1608V1R0DT0S1 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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