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MLP2012S2R2TT0S1 - TDK

Description: SMD / SMT Inductors (Coils), L=2.2?H, L x W x T :

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MLP2012S2R2TT0S1 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLP2012S2R2TT0S1
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MLP2012S2R2TT0S1 - TDK  - 3D model - Inductors Chip - MLP2012S2R2TT0S1
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MLP2012S2R2TT0S1 Details

  • Manufacturer Part Number:

    MLP2012S2R2TT0S1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6.6

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.33 Ω

  • Inductance-Nom (L):

    2.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    0.6 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 30%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    20%

MLP2012S2R2TT0S1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLP2012S2R2TT0S1 is available in the TDK Corporation's 'Recommended Land Pattern' document, which can be found on their website. It provides detailed information on the pad layout, dimensions, and spacing for optimal mounting and soldering.
  • To prevent damage, handle the MLP2012S2R2TT0S1 by the edges, avoiding touching the component body or leads. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Follow standard SMT assembly procedures, and ensure the component is properly seated and soldered to prevent mechanical stress.
  • The maximum reflow temperature for MLP2012S2R2TT0S1 is 260°C, with a peak temperature not exceeding 240°C for more than 20 seconds. It's essential to follow the recommended reflow profile to prevent damage to the component.
  • While the MLP2012S2R2TT0S1 is a robust component, it's essential to evaluate its suitability for high-vibration or high-shock applications. TDK Corporation provides vibration and shock testing data, but it's recommended to perform additional testing and analysis to ensure the component meets the specific application requirements.
  • The optimal operating frequency for the MLP2012S2R2TT0S1 depends on the specific application and circuit design. Refer to the datasheet for the component's frequency characteristics, and perform simulations or testing to determine the optimal frequency for your design.

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MLP2012S2R2TT0S1 Overview

Use the download button to access the MLP2012S2R2TT0S1 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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