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MLP2012V1R0MT0S1 - TDK

Description: Inductor Power Shielded Multi-Layer 1uH 20% 2MHz Ferrite 900mA 260mOhm DCR 0805 T/R

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PCB Footprints
MLP2012V1R0MT0S1 - TDK PCB footprint - Inductors Chip - Inductors Chip - 0805 (2012 metric)--7
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3D Models
MLP2012V1R0MT0S1 - TDK  - 3D model - Inductors Chip - 0805 (2012 metric)--7
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MLP2012V1R0MT0S1 Details

  • Manufacturer Part Number:

    MLP2012V1R0MT0S1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6.6

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.2 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Current-Max:

    0.9 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 30%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    20%

MLP2012V1R0MT0S1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLP2012V1R0MT0S1 is available in the TDK Corporation's 'Recommended Land Pattern' document, which can be found on their website or through their customer support. The document provides detailed information on the recommended pad layout, solder mask, and solder fillet dimensions for optimal assembly and reliability.
  • To prevent damage during assembly, it is recommended to handle the MLP2012V1R0MT0S1 by the edges, avoiding touching the component's surface or pads. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Additionally, follow the recommended soldering temperature and time profiles to prevent thermal damage.
  • While the datasheet specifies the rated operating temperature range, it's essential to note that the maximum operating temperature range for MLP2012V1R0MT0S1 is -40°C to +125°C. However, it's recommended to derate the component's performance and reliability at temperatures above 85°C to ensure optimal operation and longevity.
  • While the MLP2012V1R0MT0S1 is designed to be robust, it's essential to evaluate its suitability for high-vibration or high-shock applications. TDK Corporation recommends following their 'Vibration and Shock Test' guidelines to ensure the component's reliability and performance in such environments. Additionally, consider using additional mechanical support or potting compounds to enhance the component's mechanical stability.
  • To troubleshoot issues with the MLP2012V1R0MT0S1, start by reviewing the datasheet and application notes to ensure correct usage and assembly. Check for soldering defects, incorrect component orientation, or inadequate power supply decoupling. Use oscilloscopes or signal analyzers to diagnose signal integrity issues. If the problem persists, contact TDK Corporation's technical support for further assistance.

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MLP2012V1R0MT0S1 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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