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MLP2012VR47MT0S1 - TDK

Description: SMD / SMT Inductors (Coils), L=0.47?H, L x W x T :

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PCB Footprints
MLP2012VR47MT0S1 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLP2012S2R2TT0S1
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3D Models
MLP2012VR47MT0S1 - TDK  - 3D model - Inductors Chip - MLP2012S2R2TT0S1
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MLP2012VR47MT0S1 Details

  • Manufacturer Part Number:

    MLP2012VR47MT0S1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.11 Ω

  • Inductance-Nom (L):

    0.47 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Current-Max:

    1.1 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 30%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    20%

MLP2012VR47MT0S1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLP2012VR47MT0S1 can be found in the TDK Corporation's recommended footprint document or in the IPC-7351 standard. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent defects.
  • To prevent damage, handle the MLP2012VR47MT0S1 component by the edges, avoiding touching the pads or the component body. Use anti-static wrist straps, mats, or other ESD protection methods to prevent electrostatic discharge damage.
  • The maximum reflow temperature for MLP2012VR47MT0S1 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component or affect its reliability.
  • While the MLP2012VR47MT0S1 is a robust component, it's essential to evaluate its performance in a high-vibration environment. TDK Corporation provides vibration testing data, but it's recommended to perform additional testing to ensure the component meets the specific application requirements.
  • Store the MLP2012VR47MT0S1 components in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging materials, and avoid stacking components on top of each other. Follow the storage conditions specified in the datasheet or by TDK Corporation.

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MLP2012VR47MT0S1 Overview

Use the download button to access the MLP2012VR47MT0S1 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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