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MLP2016H1R5MT0S1 - TDK

Description: Inductor Power Shielded Multi-Layer 1.5uH 20% 2MHz Ferrite 1.2A 137.5mOhm DCR 0806 T/R

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PCB Footprints
MLP2016H1R5MT0S1 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLP2016
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3D Models
MLP2016H1R5MT0S1 - TDK  - 3D model - Inductors Chip - MLP2016
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MLP2016H1R5MT0S1 Details

  • Manufacturer Part Number:

    MLP2016H1R5MT0S1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    0806

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.11 Ω

  • Inductance-Nom (L):

    1.5 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    1.2 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 25%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    20%

MLP2016H1R5MT0S1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLP2016H1R5MT0S1 can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • To handle thermal considerations, ensure that the inductor is placed in a well-ventilated area, away from heat sources and heat sinks. Also, consider using thermal vias or thermal pads to dissipate heat. The maximum operating temperature of the MLP2016H1R5MT0S1 is 125°C, so ensure that the ambient temperature and self-heating do not exceed this limit.
  • The recommended soldering profile for MLP2016H1R5MT0S1 is a standard reflow soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds. However, it's recommended to consult the TDK Corporation's soldering guidelines or the assembly house's recommended soldering profile for specific guidance.
  • To ensure magnetic shielding, place the inductor at least 5 mm away from other magnetic components, such as transformers or other inductors. Additionally, consider using a magnetic shield or a mu-metal shield to reduce electromagnetic interference (EMI).
  • The MLP2016H1R5MT0S1 has an MSL rating of 1, which means it can withstand normal humidity levels without special handling or storage requirements. However, it's still recommended to follow standard handling and storage procedures to prevent moisture absorption.

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MLP2016H1R5MT0S1 Overview

Use the download button to access the MLP2016H1R5MT0S1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLP20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLP2016V1R5MT0S1 TDK Corporation

General Purpose Inductor, 1.5uH, 20%, 1 Element, Ferrite-Core, SMD, 0806