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MLP2520V1R0MT0S1 - TDK

Description: SMD / SMT Inductors (Coils), L=1?H, L x W x T :

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PCB Footprints
MLP2520V1R0MT0S1 - TDK PCB footprint - Inductors Chip - Inductors Chip - 2520
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3D Models
MLP2520V1R0MT0S1 - TDK  - 3D model - Inductors Chip - 2520
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MLP2520V1R0MT0S1 Details

  • Manufacturer Part Number:

    MLP2520V1R0MT0S1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.1 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    1.3 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 30%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    20%

MLP2520V1R0MT0S1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLP2520V1R0MT0S1 can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad layout, dimensions, and spacing for optimal performance and reliability.
  • Thermal management is crucial for the MLP2520V1R0MT0S1. It's recommended to use a thermal pad or a heat sink to dissipate heat generated by the inductor. The thermal pad should be connected to a solid ground plane or a thermal vias to ensure efficient heat dissipation. Additionally, ensure that the surrounding components are not sensitive to high temperatures.
  • The maximum current rating for MLP2520V1R0MT0S1 is not explicitly stated in the datasheet. However, according to TDK Corporation's application notes, the maximum current rating is typically determined by the inductor's saturation current, which is around 2.5A for this specific part. It's essential to consult with TDK Corporation's application engineers or refer to their design guides for more information.
  • The MLP2520V1R0MT0S1 is designed for high-frequency applications, but its performance may degrade above a certain frequency. The datasheet provides information on the inductor's impedance vs. frequency, which can help determine its suitability for a specific application. However, it's recommended to consult with TDK Corporation's application engineers or refer to their design guides for more information on high-frequency design considerations.
  • To ensure the reliability of MLP2520V1R0MT0S1 in a harsh environment, it's essential to follow proper design and assembly guidelines. This includes using a robust PCB design, ensuring proper soldering and cleaning, and protecting the component from moisture and mechanical stress. Additionally, consider using conformal coating or potting to protect the component from environmental factors.

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MLP2520V1R0MT0S1 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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