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MLP2520V3R3MT0S1 - TDK

Description: SMD / SMT Inductors (Coils), L=3.3?H, L x W x T :

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MLP2520V3R3MT0S1 - TDK - PCB symbol
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PCB Footprints
MLP2520V3R3MT0S1 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLP2520
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3D Models
MLP2520V3R3MT0S1 - TDK - 3D model - Inductors Chip - MLP2520
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MLP2520V3R3MT0S1 Details

  • Manufacturer Part Number:

    MLP2520V3R3MT0S1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6.6

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.2 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    0.9 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 30%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    20%

MLP2520V3R3MT0S1 Frequently Asked Questions (FAQs)

  • TDK recommends a land pattern with a minimum pad size of 1.3mm x 1.3mm and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
  • The power rating derating for MLP2520V3R3MT0S1 depends on the ambient temperature and airflow. Refer to the TDK application note 'Power Rating Derating Curve' for detailed information on how to calculate the derated power rating for your specific application.
  • TDK recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 60-120 seconds to ensure reliable soldering and minimize thermal stress.
  • Yes, MLP2520V3R3MT0S1 is designed to withstand high-vibration environments. However, it's essential to follow TDK's recommended mounting and soldering guidelines to ensure reliable operation. Additionally, consider performing vibration testing to validate the component's performance in your specific application.
  • To ensure reliability in humid environments, follow TDK's recommended storage and handling guidelines, and consider applying a conformal coating to the component. Additionally, ensure that the component is properly soldered and that the PCB is designed with moisture-resistant materials and features.

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MLP2520V3R3MT0S1 Overview

Use the download button to access the MLP2520V3R3MT0S1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLP25, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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