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MLX90316KDC-BCG-200-RE - Melexis

Description: Board Mount Hall Effect / Magnetic Sensors Rotary Position Sensor IC

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MLX90316KDC-BCG-200-RE - Melexis - PCB symbol
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MLX90316KDC-BCG-200-RE - Melexis PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8
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MLX90316KDC-BCG-200-RE - Melexis - 3D model - Small Outline Packages - SOIC8
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MLX90316KDC-BCG-200-RE Details

  • Manufacturer Part Number:

    MLX90316KDC-BCG-200-RE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Manufacturer:

    Melexis Microelectronic Integrated Systems

  • Additional Feature:

    ITS ALSO HAVE DIGITAL OUTPUT CURRENT -20 TO 20 MILLI AMPERE

  • Body Breadth:

    3.9 mm

  • Body Height:

    1.62 mm

  • Body Length or Diameter:

    4.89 mm

  • Housing:

    PLASTIC

  • JESD-609 Code:

    e3

  • Measurement Range-Max (deg):

    360 deg

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    8

  • Operating Current-Max:

    16 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SINGLE-ENDED

  • Output Circuit Type:

    SINGLE-ENDED

  • Output Interface Type:

    3-WIRE INTERFACE

  • Output Range:

    -8-8mA

  • Output Type:

    ANALOG CURRENT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape/Style:

    RECTANGULAR

  • Response Time:

    400 µs

  • Sensors/Transducers Type:

    ROTARY POSITION SENSOR,HALL EFFECT

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Termination Type:

    SOLDER

MLX90316KDC-BCG-200-RE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and a solid ground connection to the device's GND pin is recommended. Additionally, keep the analog and digital signal traces separate and avoid running them parallel to each other.
  • To ensure accurate temperature measurement, ensure that the device is properly calibrated, and the thermal interface material (TIM) is applied correctly. Also, avoid exposing the device to extreme temperatures, humidity, or vibrations during operation.
  • The recommended power-up sequence is to apply VCC first, followed by VDD, and then the clock signal. This ensures that the internal voltage regulators are properly initialized and the device is configured correctly.
  • To minimize EMI, use a shielded cable for the sensor connections, and ensure that the PCB layout is designed to minimize radiation. Additionally, use a common-mode choke or ferrite bead to filter out high-frequency noise.
  • The device is designed to withstand vibrations up to 10g RMS (root mean square) in the frequency range of 10 Hz to 2 kHz. Exceeding this limit may affect the device's accuracy and reliability.

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MLX90316KDC-BCG-200-RE Overview

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