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MLZ2012E4R7MT - TDK

Description: TDK 4.7 μH ±20% Ferrite Multilayer SMD Inductor, 0805 (2012M) Case, SRF: 70MHz 400mA dc 300mΩ Rdc

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Symbol
MLZ2012E4R7MT - TDK - PCB symbol
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PCB Footprints
MLZ2012E4R7MT - TDK PCB footprint - Inductors Chip - Inductors Chip - MLZ2012E
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3D Models
MLZ2012E4R7MT - TDK - 3D model - Inductors Chip - MLZ2012E
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MLZ2012E4R7MT Details

  • Manufacturer Part Number:

    MLZ2012E4R7MT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP, 2012M, ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    0805

  • Construction:

    Magnetic Shielded

  • Core Material:

    FERRITE

  • DC Resistance:

    0.3 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Rated Current-Max:

    0.4 A

  • Self Resonance Frequency:

    70 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DCR IS MEASURED AT 30% TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    20%

MLZ2012E4R7MT Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLZ2012E4R7MT is a rectangular pad with a size of 1.2mm x 1.4mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To minimize the risk of damage to the MLZ2012E4R7MT during reflow soldering, it is recommended to follow a temperature profile with a peak temperature of 260°C or less, and a dwell time of 30 seconds or less above 220°C. Additionally, a nitrogen atmosphere can help reduce oxidation and improve solderability.
  • Yes, the MLZ2012E4R7MT is suitable for high-frequency applications up to 1 GHz. However, it is recommended to consult the impedance vs. frequency graph in the datasheet to ensure that the inductor's impedance meets the requirements of your specific application.
  • To ensure the MLZ2012E4R7MT is properly secured to the PCB, it is recommended to use a sufficient amount of solder paste and to follow a proper soldering process. Additionally, the PCB should be designed with a sufficient keep-out area around the inductor to prevent mechanical stress and vibration.
  • Yes, the MLZ2012E4R7MT should be stored in a dry, cool place away from direct sunlight and moisture. It is also recommended to handle the components by the edges or the reel to prevent damage to the terminations or the component body.

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MLZ2012E4R7MT Overview

Use the download button to access the MLZ2012E4R7MT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLZ20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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