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MM3Z18VT1G - onsemi

Description: Zener Diode 18 V 300 mW ±6% Surface Mount SOD-323

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PCB Footprints
MM3Z18VT1G - onsemi PCB footprint - Other - Other - SOD−323 1.70x1.25x0.85 CASE 477 ISSUE K_2025-1
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3D Models
MM3Z18VT1G - onsemi  - 3D model - Other - SOD−323 1.70x1.25x0.85 CASE 477 ISSUE K_2025-1
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MM3Z18VT1G Details

  • Manufacturer Part Number:

    MM3Z18VT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    45 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    80 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    18 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    12.6 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    6.41%

  • Working Test Current:

    5 mA

MM3Z18VT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package is recommended to be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system.
  • The maximum allowed voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation and prevent damage to the device.
  • Handle the device with an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors on the input pins.
  • A gate resistor value between 10Ω to 100Ω is recommended, depending on the specific application and switching frequency. A lower value can improve switching speed, but may increase power consumption.

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MM3Z18VT1G Overview

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Part Image MM3Z18VT1 Formosa Microsemi Co Ltd

Zener Diode, 18V V(Z), 6.6%, 0.2W