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MM3Z30VST1G - onsemi

Description: Standard Zener Breakdown Voltage Range − 3.3 V to 36 V Steady State Power Rating of 500 mW Small Body Outline Dimensions: 0.067″ x 0.049″ (1.7 mm x 1.25 mm) Low Body Height: 0.035″ (0.9 mm) Package Weight: 4.507 mg/unit ESD Rating of Class 3 (> 16 kV) per Human Body Model Tight Tolerance VZ SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are Ro

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MM3Z30VST1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323 - case 477-02 - issue H
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MM3Z30VST1G - onsemi  - 3D model - Small Outline Diode - SOD-323 - case 477-02 - issue H
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MM3Z30VST1G Details

  • Manufacturer Part Number:

    MM3Z30VST1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    80 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Reference Voltage-Nom:

    30 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    2.51%

  • Working Test Current:

    5 mA

MM3Z30VST1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MM3Z30VST1G should include a solid ground plane, short and wide traces for the input and output, and a decoupling capacitor (e.g., 100nF) close to the device. Additionally, keep the input and output traces separate to minimize noise coupling.
  • To ensure reliable operation over the full temperature range (-40°C to 150°C), follow proper PCB design and assembly guidelines, use a suitable thermal interface material (e.g., thermal tape or thermal grease) between the device and heat sink, and consider using a heat sink with a thermal resistance of ≤10°C/W.
  • Although the datasheet specifies a maximum input voltage of 30V, it's recommended to limit the input voltage to 25V to ensure reliable operation and prevent damage to the device.
  • While the MM3Z30VST1G is suitable for high-frequency applications, its performance may degrade above 100 kHz due to internal capacitances and inductances. For frequencies above 100 kHz, consider using a more specialized voltage regulator or a different device.
  • To protect the MM3Z30VST1G from electrostatic discharge (ESD), follow proper handling and storage procedures, use ESD-protective packaging and materials, and consider adding external ESD protection devices (e.g., TVS diodes) to the PCB design.

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MM3Z30VST1G Overview

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