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MM3Z3V0ST1G - onsemi

Description: Standard Zener Breakdown Voltage Range - 2.4 V to 75 V; Steady State Power Rating of 300 mW; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics:; Tight Tolerance ; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; FLAMMABILITY RATING: UL94 V-0; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; AEC-Q101 Qualified and PPAP Capable ; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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MM3Z3V0ST1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD−323 1.70x1.25x0.85
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MM3Z3V0ST1G - onsemi  - 3D model - Small Outline Diode - SOD−323 1.70x1.25x0.85
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MM3Z3V0ST1G Details

  • Manufacturer Part Number:

    MM3Z3V0ST1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    100 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    3.49%

  • Working Test Current:

    5 mA

MM3Z3V0ST1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • Ensure that the device is operated within the recommended operating conditions, including voltage, current, and temperature. Also, follow proper PCB design and layout guidelines to minimize thermal resistance and ensure good heat dissipation.
  • The MM3Z3V0ST1G has built-in ESD protection, but handling precautions should still be taken to prevent damage. Use an anti-static wrist strap or mat, and handle the device by the body or pins, not the leads.
  • Yes, the MM3Z3V0ST1G is AEC-Q101 qualified and suitable for high-reliability and automotive applications. However, ensure that the device is used within the recommended operating conditions and follows the application notes for reliable operation.
  • Use a systematic approach to troubleshoot issues, checking the device's operating conditions, PCB layout, and component selection. Consult the datasheet and application notes for guidance, and consider using simulation tools or consulting with onsemi support if needed.

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MM3Z3V0ST1G Overview

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