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MM3Z3V3T1G - onsemi

Description: Wide Zener Voltage Range Selection, 2.4V to 75V; VZ Tolerance Selection of ±5% (C Series); Very Small and Thin SMD package; Matte Tin(Sn) finish, Pb Free

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Symbol
MM3Z3V3T1G - onsemi - PCB symbol
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PCB Footprints
MM3Z3V3T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD−323 1.70x1.25x0.85 CASE 477 ISSUE K
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3D Models
MM3Z3V3T1G - onsemi - 3D model - Small Outline Diode - SOD−323 1.70x1.25x0.85 CASE 477 ISSUE K
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MM3Z3V3T1G Details

  • Manufacturer Part Number:

    MM3Z3V3T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    95 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1000 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    3.3 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    6.06%

  • Working Test Current:

    5 mA

MM3Z3V3T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal relief pattern is recommended. Refer to the onsemi application note AND9093/D for more details.
  • The device requires a stable input voltage (VIN) and a proper biasing of the enable pin (EN) to ensure optimal performance. Refer to the datasheet for the recommended voltage and current ratings.
  • The device is sensitive to electrostatic discharge (ESD). Handle the device with an ESD wrist strap or mat, and avoid touching the pins or leads to prevent damage.
  • The device is rated for operation up to 125°C. However, the maximum operating temperature may be limited by the specific application and PCB design. Ensure proper thermal management and derate the device accordingly.
  • Check the input voltage, output load, and PCB layout for any issues. Verify that the device is properly biased and that the enable pin is properly configured. Consult the datasheet and application notes for troubleshooting guidelines.

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MM3Z3V3T1G Overview

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MM3Z3V3T1G Alternates

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For a full list of alternate parts for MM3Z3V3T1G, check out Findchips.com