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MM3Z4V3B - onsemi

Description: Wide Zener Voltage Range Selection, 2.4V to 75V; VZ Tolerance Selection of ±2% (B Series); Very Small and Thin SMD package; Matte Tin(Sn) finish, Pb Free

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PCB Footprints
MM3Z4V3B - onsemi PCB footprint - Other - Other - SOD-323F
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MM3Z4V3B - onsemi  - 3D model - Other - SOD-323F
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MM3Z4V3B Details

  • Manufacturer Part Number:

    MM3Z4V3B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323FL

  • Package Description:

    SOD-323FL, SC-90, 2 PIN

  • Manufacturer Package Code:

    477AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    84 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    564 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    4.3 V

  • Reverse Current-Max:

    2.7 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

MM3Z4V3B Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling capability at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. The device should be soldered using a no-clean or water-soluble flux.
  • Handle the device in an ESD-controlled environment. Use ESD-protective packaging and wrist straps or mats. Ground all equipment and personnel before handling the device.
  • Store the device in its original packaging or in a dry, ESD-protected environment. Avoid exposing the device to moisture, direct sunlight, or extreme temperatures.

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MM3Z4V3B Overview

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Part Image MM3Z4V3B Fairchild Semiconductor Corporation

Zener Diode, 4.3V V(Z), 2%, 0.2W, Silicon, Unidirectional