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MM3Z56VB - onsemi

Description: Wide Zener Voltage Range Selection, 2.4V to 75V; VZ Tolerance Selection of ±2% (B Series); Very Small and Thin SMD package; Matte Tin(Sn) finish, Pb Free

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PCB Footprints
MM3Z56VB - onsemi PCB footprint - Other - Other - SOD−323FL CASE 477AB ISSUE A_2025-2
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MM3Z56VB - onsemi  - 3D model - Other - SOD−323FL CASE 477AB ISSUE A_2025-2
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MM3Z56VB Details

  • Manufacturer Part Number:

    MM3Z56VB

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323FL

  • Package Description:

    SOD-323FL, SC-90, 2 PIN

  • Manufacturer Package Code:

    477AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    188 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    400 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    56 V

  • Reverse Current-Max:

    0.045 µA

  • Reverse Test Voltage:

    39.2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tol-Max:

    2%

  • Working Test Current:

    5 mA

MM3Z56VB Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure the device is operated within the recommended temperature range (–40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power dissipation at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds is recommended. Avoid exceeding 280°C (536°F) to prevent damage to the device.
  • Use an ESD-protected workstation and follow proper handling procedures to prevent damage. The device has an internal ESD protection diode, but external protection is still recommended to prevent damage during handling and assembly.
  • Store the device in a dry, cool place (–40°C to 30°C) with relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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MM3Z56VB Overview

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Part Image MM3Z56VB Fairchild Semiconductor Corporation

Zener Diode, 56V V(Z), 2%, 0.2W, Silicon, Unidirectional