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MM3Z68VT1G - onsemi

Description: Wide Zener Voltage Range Selection, 2.4V to 75V; VZ Tolerance Selection of ±5% (C Series); Very Small and Thin SMD package; Matte Tin(Sn) finish, Pb Free

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PCB Footprints
MM3Z68VT1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323
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3D Models
MM3Z68VT1G - onsemi  - 3D model - Small Outline Diode - SOD-323
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MM3Z68VT1G Details

  • Manufacturer Part Number:

    MM3Z68VT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOD-323 2 LEAD

  • Pin Count:

    2

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    240 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    500 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    68 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    47.6 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5.88%

  • Working Test Current:

    2 mA

MM3Z68VT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the package.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal monitoring and cooling systems.
  • The MM3Z68VT1G has built-in ESD protection, but it's still important to follow standard ESD handling precautions, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging and storage.
  • Yes, the MM3Z68VT1G is suitable for high-reliability and automotive applications, but it's essential to follow the recommended operating conditions, and ensure that the device is properly qualified and validated for the specific application.
  • The recommended soldering and assembly techniques for the MM3Z68VT1G include using a soldering iron with a temperature range of 250°C to 260°C, and following the recommended soldering profile and assembly guidelines provided by onsemi.

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MM3Z68VT1G Overview

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Part Image MM3Z68VT1 Formosa Microsemi Co Ltd

Zener Diode, 68V V(Z), 5.8%, 0.2W

Part Image MM3Z68VT1 onsemi

Zener Diode, 68V V(Z), 5.88%, 0.2W, Silicon, Unidirectional