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MM5Z4688T1G - onsemi

Description: Wide Zener Breakdown Voltage Range - 1.8 V to 43 V; Small Body Outline Dimensions: 1.20 mm X 0.6 mm; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Low Reverse Current (IZT) - 50µA

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MM5Z4688T1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-523 CASE 502
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MM5Z4688T1G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-523 CASE 502
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MM5Z4688T1G Details

  • Manufacturer Part Number:

    MM5Z4688T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523-2

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Voltage-Nom:

    4.7 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    4.99%

  • Working Test Current:

    0.05 mA

MM5Z4688T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MM5Z4688T1G should include a solid ground plane, wide traces for power and ground, and a thermal relief pattern around the device. A 4-layer PCB with a dedicated thermal layer is recommended. Consult onsemi's application note AND9093/D for more details.
  • To ensure reliable operation at high temperatures, follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Also, consider derating the device's power dissipation according to the temperature derating curve in the datasheet.
  • The recommended soldering profile for the MM5Z4688T1G is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. Consult onsemi's application note AND9093/D for more details.
  • Yes, the MM5Z4688T1G is suitable for high-reliability and automotive applications. It is AEC-Q101 qualified and meets the requirements for automotive-grade devices. However, ensure that you follow the recommended operating conditions and design guidelines to ensure reliable operation.
  • The MM5Z4688T1G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded.

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MM5Z4688T1G Overview

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