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MM5Z4689T1G - onsemi

Description: Wide Zener Breakdown Voltage Range - 1.8 V to 43 V; Small Body Outline Dimensions: 1.20 mm X 0.6 mm; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; Low Reverse Current (IZT) - 50µA

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MM5Z4689T1G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - MM5Z4689T1G-
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MM5Z4689T1G - onsemi  - 3D model - Small Outline Diode Flat Lead - MM5Z4689T1G-
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MM5Z4689T1G Details

  • Manufacturer Part Number:

    MM5Z4689T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-523-2

  • Manufacturer Package Code:

    502

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Voltage-Nom:

    5.1 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    0.05 mA

MM5Z4689T1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the package to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system to keep the junction temperature within the recommended range.
  • The recommended soldering conditions for the MM5Z4689T1G are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350-370°C. It's also recommended to use a solder with a melting point of 217-220°C.
  • To handle ESD protection during handling and assembly, it's recommended to use an ESD wrist strap or mat, handle the devices by the body or pins, avoid touching the pins or leads, and use ESD-protected packaging and storage materials.
  • The recommended storage conditions for the MM5Z4689T1G are: temperature range of -40°C to 125°C, humidity of 60% or less, and protection from direct sunlight and moisture. It's also recommended to store the devices in their original packaging or in a dry, clean environment.

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MM5Z4689T1G Overview

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