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MM74HCU04N - Rochester Electronics

Description: MM74HCU04N

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PCB Footprints
MM74HCU04N - Rochester Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide+
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3D Models
MM74HCU04N - Rochester Electronics  - 3D model - Dual-In-Line Packages - 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide+
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MM74HCU04N Details

  • Manufacturer Part Number:

    MM74HCU04N

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    DIP,

  • Pin Count:

    14

  • Reach Compliance Code:

    Unknown

  • Manufacturer:

    Rochester Electronics LLC

  • Family:

    HC/UH

  • JESD-30 Code:

    R-PDIP-T14

  • JESD-609 Code:

    e3

  • Length:

    19.18 mm

  • Logic IC Type:

    INVERTER

  • Moisture Sensitivity Level:

    NOT APPLICABLE

  • Number of Functions:

    6

  • Number of Inputs:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT APPLICABLE

  • Propagation Delay (tpd):

    103 ns

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT APPLICABLE

  • Width:

    7.62 mm

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MM74HCU04N Overview

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