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MM9Z1I638BM2EP - NXP

Description: Battery Management IC MCU LIN BATTERY MONITOR 48QFN

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PCB Footprints
MM9Z1I638BM2EP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48QFN-+-++
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3D Models
MM9Z1I638BM2EP - NXP  - 3D model - Quad Flat No-Lead - 48QFN-+-++
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MM9Z1I638BM2EP Details

  • Manufacturer Part Number:

    MM9Z1I638BM2EP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-48

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO OPERATES AT 3.8 TO 28 VOLT

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY MONITOR

  • JESD-30 Code:

    S-XQCC-N48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.27SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max (Isup):

    40 mA

  • Supply Voltage-Max (Vsup):

    1.98 V

  • Supply Voltage-Min (Vsup):

    1.72 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    +28V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MM9Z1I638BM2EP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a ferrite bead or a 10uF capacitor to filter the power supply.
  • Use a metal shield around the device, keep the PCB layout compact, and use a common mode choke or a ferrite bead to filter the power supply. Also, ensure that the device is placed at least 1mm away from the PCB edge.
  • The maximum allowed voltage on the VDD pin is 3.6V. Exceeding this voltage may damage the device.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device, and avoid blocking the thermal pad with components or solder resist.
  • The recommended clock frequency for the MM9Z1I638BM2EP is 32.768 kHz. However, the device can operate at frequencies up to 1 MHz.

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MM9Z1I638BM2EP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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