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MMA2301KEG - NXP

Description: Integral Signal Conditioning • Linear Output • Ratiometric Performance • 4th Order Bessel Filter Preserves Pulse Shape Integrity • Calibrated Self-test • Low Voltage Detect, Clock Monitor, and EPROM Parity Check Status • Transducer Hermetically Sealed at Wafer Level for Superior Reliability • Robust Design, High Shocks Survivability • Robust Design, High Shock Survivability • Qualified AEC-Q100, Rev. F Grade 2 (-40C/ +105C)

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Symbol
MMA2301KEG - NXP - PCB symbol
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PCB Footprints
MMA2301KEG - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-16L
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3D Models
MMA2301KEG - NXP - 3D model - Small Outline Packages - SOIC-16L
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MMA2301KEG Details

  • Manufacturer Part Number:

    MMA2301KEG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, SOIC-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.55 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

MMA2301KEG Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the MMA2301KEG application note (AN4399) which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • Calibration of the MMA2301KEG involves applying known accelerations to the device and adjusting the sensitivity and offset registers to achieve accurate measurements. NXP provides a calibration procedure in the MMA2301KEG application note (AN4399).
  • The MMA2301KEG is rated for operation from -40°C to 125°C, but the accuracy and sensitivity of the device may degrade at extreme temperatures. Consult the datasheet for temperature-related specifications and limitations.
  • Yes, the MMA2301KEG is designed to operate in high-vibration environments, but the device's performance may be affected by extreme vibrations. NXP recommends using mechanical damping or filtering to reduce the effects of vibration on the device's measurements.
  • The MMA2301KEG communicates with a microcontroller through a standard I2C or SPI interface. NXP provides example code and interface guidelines in the MMA2301KEG application note (AN4399) and datasheet.

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MMA2301KEG Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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