MMBF5484 footprint, schematic symbol and 3D model by onsemi

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Datasheet Download Datasheet
Stock & Prices Price & Stock for MMBF5484
Part Number MMBF5484
Manufacturer onsemi
Pin Count 3
Part Category MOSFET (N-Channel)
Package Category SOT23 (3-Pin)
Footprint Name SOT23 (3-Pin) - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P
Released Date Oct 22, 2018
Last Modified Date Jun 16, 2026 2:48 AM UTC
Pinout / Pin List Click Here (Member Only)

MMBF5484 Details

Manufacturer Part Number:
MMBF5484
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P
Manufacturer Package Code:
318
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.21.00.95
Factory Lead Time:
15 Weeks
Manufacturer:
onsemi
YTEOL:
6.82
Configuration:
SINGLE
FET Technology:
JUNCTION
Feedback Cap-Max (Crss):
1 pF
JEDEC-95 Code:
TO-236AB
JESD-30 Code:
R-PDSO-G3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Mode:
DEPLETION MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation Ambient-Max:
0.225 W
Power Dissipation-Max (Abs):
0.225 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
AMPLIFIER
Transistor Element Material:
SILICON

MMBF5484 Frequently Asked Questions (FAQs)

The maximum safe operating area (SOA) for the MMBF5484 is not explicitly stated in the datasheet. However, it can be estimated based on the device's thermal resistance, maximum junction temperature, and power dissipation. A safe operating area can be determined by plotting the device's voltage and current ratings against the maximum power dissipation.
To ensure the MMBF5484 is properly biased, follow the recommended biasing circuit and component values provided in the datasheet. Additionally, consider the device's current gain, base-emitter voltage, and collector-emitter voltage when designing the biasing circuit. It's also important to ensure the device is operated within its recommended operating conditions.
For optimal thermal management, it's recommended to use a heat sink with a thermal resistance of less than 10°C/W. The PCB layout should be designed to minimize thermal resistance and ensure good heat dissipation. A recommended layout is to use a large copper area on the PCB as a heat sink, and to place the transistor close to the heat sink.
To protect the MMBF5484 from electrostatic discharge (ESD), follow proper handling and storage procedures. Use an anti-static wrist strap or mat when handling the device, and store the device in an anti-static bag or container. Additionally, design the circuit to include ESD protection components, such as TVS diodes or ESD protection arrays.
The reliability and failure rate expectations for the MMBF5484 are not explicitly stated in the datasheet. However, onsemi provides reliability data for their products, including the MMBF5484, in their reliability reports. These reports provide information on the device's failure rate, mean time between failures (MTBF), and other reliability metrics.

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MMBF5484 Overview

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