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MMBZ5225BLT1G - onsemi

Description: 225 mW Rating on FR-4 or FR-5 Board; Zener Voltage Range - 2.4 V to 91 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMABILITY RATING:

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Symbol
MMBZ5225BLT1G - onsemi - PCB symbol
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PCB Footprints
MMBZ5225BLT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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3D Models
MMBZ5225BLT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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MMBZ5225BLT1G Details

  • Manufacturer Part Number:

    MMBZ5225BLT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    29 Ω

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    20 mA

MMBZ5225BLT1G Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MMBZ5225BLT1G is -65°C to 150°C.
  • To ensure reliability, it's essential to follow proper derating guidelines, use a suitable thermal management system, and ensure the device is operated within its recommended specifications.
  • The maximum allowable power dissipation for the MMBZ5225BLT1G is 500 mW. Exceeding this limit can lead to device failure.
  • While the MMBZ5225BLT1G is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 MHz. However, it's essential to consider the device's parasitic capacitance and inductance when designing the circuit.
  • To prevent electrostatic discharge (ESD) damage, it's crucial to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design.

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MMBZ5225BLT1G Overview

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