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MMDL101T1G - onsemi

Description: Low Noise Figure - 6.0 dB Typ @ 1.0 GHz; Device Marking: 4M; Very Low Capacitance - Less than 1.0 pF @ Zero Volts; Pb-Free Package is Available

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Symbol
MMDL101T1G - onsemi - PCB symbol
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PCB Footprints
MMDL101T1G - onsemi PCB footprint - Other - Other - SOD-323 CASE 477-02 ISSUE H
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3D Models
MMDL101T1G - onsemi - 3D model - Other - SOD-323 CASE 477-02 ISSUE H
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MMDL101T1G Details

  • Manufacturer Part Number:

    MMDL101T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323 2 LEAD

  • Package Description:

    LEAD FREE, PLASTIC, CASE 477-02, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    477-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Additional Feature:

    LOW NOISE

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    1 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • Frequency Band:

    VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    7 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MMDL101T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below the maximum TJ. Monitor the device's thermal resistance (RθJA) and adjust the system design accordingly.
  • The MMDL101T1G has an integrated ESD protection diode, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
  • Yes, the MMDL101T1G is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard and is PPAP (Production Part Approval Process) capable. However, additional testing and validation may be required for specific applications.
  • Use a systematic approach to troubleshoot issues. Check the device's pinout and connections, ensure proper power supply and decoupling, and verify that the device is operated within its recommended specifications. Use oscilloscopes or logic analyzers to debug signal integrity issues.

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MMDL101T1G Overview

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Part Image MMDL101T1 onsemi

Mixer Diode, Very High Frequency to Ultra High Frequency, Silicon