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MMSD301T1G - onsemi

Description: Extremely Low Minority Carrier Lifetime; Low Reverse Leakage; Very Low Capacitance; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

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Symbol
MMSD301T1G - onsemi - PCB symbol
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PCB Footprints
MMSD301T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123
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3D Models
MMSD301T1G - onsemi - 3D model - Small Outline Diode - SOD-123
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MMSD301T1G Details

  • Manufacturer Part Number:

    MMSD301T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    1.5 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Forward Voltage-Max (VF):

    0.6 V

  • Frequency Band:

    ULTRA HIGH FREQUENCY

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.225 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    25 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MMSD301T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to improve heat dissipation.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device when designing the system.
  • Onsemi recommends using a human body model (HBM) ESD protection circuit with a minimum of 2kV rating. Additionally, ensure that the PCB layout and component placement minimize the risk of ESD damage.
  • Yes, the MMSD301T1G is suitable for high-reliability applications. However, it's essential to follow onsemi's recommended design and manufacturing guidelines to ensure the device meets the required reliability standards.
  • The MMSD301T1G requires a specific power sequencing to prevent damage. Ensure that the input voltage (VIN) is applied before the enable signal (EN) is asserted. Also, ensure that the output voltage (VOUT) is not loaded until the device is fully enabled.

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MMSD301T1G Overview

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