Description:500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit
The recommended land pattern for MMSZ4696T1G is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.1 mm. The pad should be centered on the component and have a non-solder-mask-defined (NSMD) pad shape.
To handle the ESD sensitivity of MMSZ4696T1G, it is recommended to follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and storing the components in an ESD-safe environment. Additionally, the device should be handled by the body or leads, rather than the glass diode, to prevent damage.
The maximum allowable voltage for MMSZ4696T1G is 100 V, which is the maximum reverse voltage rating. Exceeding this voltage can cause permanent damage to the device.
MMSZ4696T1G is rated for operation up to 150°C, but its performance may degrade at high temperatures. It is recommended to derate the device's voltage and current ratings at high temperatures to ensure reliable operation.
To ensure the reliability of MMSZ4696T1G in a humid environment, it is recommended to follow proper moisture sensitivity level (MSL) handling procedures, such as baking the devices before use, and storing them in a dry environment. Additionally, the device should be soldered and cleaned properly to prevent moisture ingress.
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MMSZ4696T1G Overview
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