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MMSZ5231BHE3-TP - MCC

Description: Zener Diodes

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Symbol
MMSZ5231BHE3-TP - MCC - PCB symbol
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PCB Footprints
MMSZ5231BHE3-TP - MCC PCB footprint - Small Outline Diode - Small Outline Diode - SOD - 123-1
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3D Models
MMSZ5231BHE3-TP - MCC - 3D model - Small Outline Diode - SOD - 123-1
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MMSZ5231BHE3-TP Details

  • Manufacturer Part Number:

    MMSZ5231BHE3-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-123, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    17 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    2

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.5 W

  • Reference Voltage-Nom:

    5.1 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Working Test Current:

    20 mA

MMSZ5231BHE3-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MMSZ5231BHE3-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • MMSZ5231BHE3-TP is rated for operation up to 150°C, but it's recommended to derate the voltage and current ratings at higher temperatures. Consult the datasheet and application notes for more information on high-temperature operation.
  • MMSZ5231BHE3-TP has an internal ESD protection diode, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • The recommended soldering profile for MMSZ5231BHE3-TP is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Consult the datasheet and application notes for more information on soldering profiles.
  • MMSZ5231BHE3-TP is a general-purpose Zener diode, not specifically designed for low-dropout regulator applications. For LDO applications, consider using a dedicated LDO regulator IC or a Zener diode specifically designed for LDO applications.

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MMSZ5231BHE3-TP Overview

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