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MMSZ5V1T1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

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PCB Footprints
MMSZ5V1T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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MMSZ5V1T1G - onsemi  - 3D model - Small Outline Diode - SOD-123 CASE425-04 ISSUE G
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MMSZ5V1T1G Details

  • Manufacturer Part Number:

    MMSZ5V1T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    60 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    480 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Reference Voltage-Nom:

    5.1 V

  • Reverse Current-Max:

    2 µA

  • Reverse Test Voltage:

    2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    1.2 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

MMSZ5V1T1G Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MMSZ5V1T1G is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a solder mask clearance of 0.1 mm.
  • To handle the ESD sensitivity of the MMSZ5V1T1G, it is recommended to use ESD protection devices, such as TVS diodes, and follow proper handling and storage procedures to prevent damage from electrostatic discharge.
  • The maximum operating temperature range for the MMSZ5V1T1G is -65°C to 150°C, but the recommended operating temperature range is -40°C to 125°C for optimal performance and reliability.
  • Yes, the MMSZ5V1T1G is suitable for high-reliability applications, such as aerospace, automotive, and industrial control systems, due to its high reliability and robustness.
  • To ensure the MMSZ5V1T1G is properly soldered, follow the recommended soldering profile, use a solder with a melting point below 260°C, and avoid excessive soldering temperatures and times.

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MMSZ5V1T1G Overview

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For a full list of alternate parts for MMSZ5V1T1G, check out Findchips.com