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MMXZ5223B-TP - MCC

Description: Zener Voltages from 2.7V-39V • Planar Die Construction • Ideally Suited for Automated Assembly Processes • Halogen Free. “Green” Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant t ("P" Suffix Designates RoHS Compliant. See Ordering Information)

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MMXZ5223B-TP - MCC - PCB symbol
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PCB Footprints
MMXZ5223B-TP - MCC PCB footprint - Small Outline Diode - Small Outline Diode - SOD-323as-1
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3D Models
MMXZ5223B-TP - MCC - 3D model - Small Outline Diode - SOD-323as-1
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MMXZ5223B-TP Details

  • Manufacturer Part Number:

    MMXZ5223B-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    30 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    1300 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    2.7 V

  • Reverse Current-Max:

    75 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    20 mA

MMXZ5223B-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the MMXZ5223B-TP can be found in the IPC-7351 standard or in the Micro Commercial Components' application note. A typical footprint would be a rectangular pad with a size of 1.5mm x 0.8mm, with a 0.5mm x 0.5mm thermal pad in the center.
  • To handle thermal considerations, ensure a good thermal connection between the device and the PCB by using a thermal pad or a copper pour under the device. Keep the thermal resistance low by minimizing the distance between the device and the thermal pad, and using a sufficient copper thickness. A thermal resistance of less than 10°C/W is recommended.
  • The maximum allowable voltage derating for the MMXZ5223B-TP is typically 10-15% of the nominal voltage rating. This means that if the device is rated for 22V, the maximum allowable voltage derating would be around 19.8-20.9V. However, it's recommended to consult the datasheet and application notes for specific derating guidelines.
  • The MMXZ5223B-TP is a commercial-grade device, and its use in high-reliability or aerospace applications may require additional testing and qualification. It's recommended to consult with the manufacturer and relevant industry standards (e.g., MIL-STD-883) to ensure the device meets the required specifications and reliability requirements.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines. The MMXZ5223B-TP can be soldered using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. Ensure the device is properly aligned and the solder paste is evenly distributed to prevent solder bridging or opens.

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MMXZ5223B-TP Overview

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Part Image MMXZ5223B Micro Commercial Components

Zener Diode, 2.7V V(Z), 5%, 0.2W, Silicon, Unidirectional