- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for MMXZ5227B-TP
- Part Number MMXZ5227B-TP
- Manufacturer MCC
- Pin Count 2
- Part Category Zener Diode
- Package Category Small Outline Diode
- Footprint Name Small Outline Diode - SOD-323 (Thickness 1ccc.15mm)
- Released Date Jan 10, 2024
- Last Modified Date May 17, 2024 4:34 PM UTC
- Pinout / Pin List Click Here (Member Only)
MMXZ5227B-TP Details
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Manufacturer Part Number:
MMXZ5227B-TP
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
ROHS COMPLIANT, PLASTIC PACKAGE-2
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Pin Count:
2
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.50
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Manufacturer:
Micro Commercial Components
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YTEOL:
7.1
MMXZ5227B-TP Frequently Asked Questions (FAQs)
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The recommended footprint and land pattern for the MMXZ5227B-TP can be found in the IPC-7351 standard or in the Micro Commercial Components' application note. A typical footprint would be a rectangular pad with a size of 1.3mm x 0.8mm, with a 0.5mm x 0.5mm thermal pad in the center.
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To ensure proper thermal performance, it's essential to provide a good thermal path from the MMXZ5227B-TP to a heat sink or a copper plane on the PCB. A minimum of 1 oz copper thickness is recommended, and the thermal pad should be connected to a large copper area or a heat sink to dissipate heat efficiently.
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The maximum allowable power dissipation for the MMXZ5227B-TP is 500mW. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB and heat sink. It's essential to calculate the power dissipation and ensure it's within the safe operating range to prevent overheating and damage to the device.
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The MMXZ5227B-TP is a commercial-grade device, and its reliability and performance may not meet the requirements of high-reliability or aerospace applications. For such applications, it's recommended to use a device that is specifically designed and qualified for those environments, such as a MIL-PRF-19500 or ESCC-qualified device.
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To ensure proper soldering and assembly, follow the recommended soldering profile and temperature guidelines. The MMXZ5227B-TP is a lead-free device, and it's recommended to use a soldering iron with a temperature range of 250°C to 260°C. Additionally, ensure the PCB is clean and free of contaminants, and use a solder paste with a suitable flux type.
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MMXZ5227B-TP Overview
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