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MMZ0603S601HTD25 - TDK

Description: Ferrite Beads 0603 0.75ohm 25% 280mA AEC-Q200

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Symbol
MMZ0603S601HTD25 - TDK - PCB symbol
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PCB Footprints
MMZ0603S601HTD25 - TDK PCB footprint - Ferrite Bead Chip - Ferrite Bead Chip - 0603
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3D Models
MMZ0603S601HTD25 - TDK - 3D model - Ferrite Bead Chip - 0603
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MMZ0603S601HTD25 Details

  • Manufacturer Part Number:

    MMZ0603S601HTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    EIA STD PACKAGE SIZE 0201, SMD, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.79

  • Construction:

    Chip Bead

  • DC Resistance-Max:

    0.75 Ω

  • Filter Type:

    FERRITE CHIP

  • Height:

    0.3 mm

  • Length:

    0.6 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Impedance:

    600 OHM Ω

  • Packing Method:

    TR, 7 INCH

  • Rated Current:

    0.28 A

  • Screening Level:

    AEC-Q200

  • Width:

    0.3 mm

MMZ0603S601HTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MMZ0603S601HTD25 is a rectangular pad with a size of 0.65mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • The MMZ0603S601HTD25 is rated for operation up to 125°C, but it's recommended to derate the component's specifications according to the temperature derating curve provided in the datasheet. Additionally, ensure that the component is properly soldered and mounted to prevent thermal stress.
  • Handle the MMZ0603S601HTD25 by the edges or the body, avoiding touching the terminations or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The recommended soldering profile for MMZ0603S601HTD25 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the specified temperature range and time to prevent damage to the component.
  • The MMZ0603S601HTD25 is not hermetically sealed, so it's not recommended for use in humid or moist environments. If exposure to moisture is unavoidable, ensure that the component is properly sealed or coated to prevent moisture ingress.

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MMZ0603S601HTD25 Overview

Use the download button to access the MMZ0603S601HTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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