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MMZ1608B102CTA00 - TDK

Description: Chip Beads, |Z|=1000? at 100MHz, L x W x T :

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Symbol
MMZ1608B102CTA00 - TDK - PCB symbol
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PCB Footprints
MMZ1608B102CTA00 - TDK PCB footprint - Ferrite Bead Chip - Ferrite Bead Chip - MMZ1608
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3D Models
MMZ1608B102CTA00 - TDK - 3D model - Ferrite Bead Chip - MMZ1608
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MMZ1608B102CTA00 Details

  • Manufacturer Part Number:

    MMZ1608B102CTA00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    EIA STD PACKAGE SIZE 1608, SMD, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.09

  • Construction:

    Chip Bead

  • DC Resistance-Max:

    0.6 Ω

  • Filter Type:

    FERRITE CHIP

  • Height:

    0.8 mm

  • Length:

    1.6 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Impedance:

    1000 OHM Ω

  • Packing Method:

    TR, 7 INCH

  • Rated Current:

    0.3 A

  • Terminal Finish:

    Tin/Nickel/Copper (Sn/Ni/Cu)

  • Width:

    0.8 mm

MMZ1608B102CTA00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MMZ1608B102CTA00 is a rectangular pad with a size of 1.6mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask opening of 1.2mm x 0.6mm.
  • During reflow soldering, the component should be placed on a flat, even surface to prevent warping or bending. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature with a 3-5 minute dwell time above 220°C.
  • The maximum operating temperature range for MMZ1608B102CTA00 is -55°C to +125°C. However, the component is designed to operate optimally between -40°C to +85°C.
  • MMZ1608B102CTA00 should be stored in a dry, cool place away from direct sunlight and moisture. The component should be handled with care to prevent mechanical stress, bending, or twisting. It is recommended to use anti-static packaging and handling procedures to prevent electrostatic discharge (ESD) damage.
  • The recommended soldering method for MMZ1608B102CTA00 is reflow soldering using a Pb-free solder alloy with a melting point of 217°C to 220°C. Wave soldering is not recommended due to the component's small size and sensitive internal structure.

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MMZ1608B102CTA00 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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